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Wrap Around Applicationͼ1

Wrap Around Application

2011-06-08 13:562220 Inquiries
Price Negotiable
Delivery MalaysiaSelangorPetaling JayaWithin 3 days after payment  
Insufficient stock for this product
Product Details
Wrap Around Application

Depending on the box format either 3 or 5 application heads with two jetting elements each are typically used. Normally the beads are applied by intermittent mode.

Robatech systems are featuring

  • Simple to learn and to operate
  • Precise cut-off, minimal nozzle blockage
  • Full modularity and compatibility, system solutions by combining modules
  • Few spare parts needed
  • Field proven products, low maintenance cost, low life cycle cost
  • Swiss quality

Suggested Solution for Wrap Around Packaging

  • Concept-Serie hotmelt appliances
  • SX-series jetting heads
  • Built-in pattern control AS-IK40/8
  • Glue bead verification
  • Granule feeder
  • System Integration into the host machine:
    RobaPAR, SNMP, Ethernet, CAN-Bus oder Profibus

Leaflets

Concept Series: (pdf) >>

Hotmelt applicator heads SX/AX: (pdf) >>

Granule Feeder GF: (pdf) >>

 
 

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ROBATECH (M) SDN BHD

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