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Single- and double-sided PCBs

Some of our standards
Properties	Values
max. circuit board size	570 x 500 mm
circuit board thickness	max. 2.4 mm* min. 0.6 mm
copper cladding (base copper)	18 µm, 35 µm, 70 µm, 105 µm
material	FR4 (TG 135, TG 150, TG 170)
surface finishes	HAL, HAL lead-free, electroless nickel/ immersion gold, immersion tin, immersion silver
min. tool diameter	0.25 mm
min. conductor track width and distance	100/100 µm
aspect ratio (hole diameter : circuit board thickness)	1 : 8
additional printing	legend printing via fill print peelable resist
	* greater thickness upon request

Standardised documentation
Documentation	Standard
Inspection certificate	According to DIN EN 10204
Factory inspection certificate	According to DIN EN 10204 Inspection according to IPC-A-6011
Initial sample inspection “standard”	According to DIN EN 10204 Inspection according to IPC-A-6011
Initial sample inspection “thorough”	According to DIN EN 10204 Inspection according to IPC-A-6011

Overview of surfaces
	Lead-free	Layer thickness	Shelf life	Comments
Hot Air Leveling (HAL)	No (HAL SnPb)	1... 40 μm	12 months	no longer permissible since 2006 (exception: see guidelines)
Hot Air Leveling (HAL)	Yes	1... 40 μm	12 months	high process temperature (265-280 °C) increased Cu removal, dependent on layout
Chemical nickel-gold cNiAu	Yes	4 ... 7 μm Ni 0,075…±0,025 μm Au	12 months	low process-temperature (approx. 90 °C) smooth coating connection made to Ni
Chemical tin cSn	Yes	0,8 ... 1,1 μm	6 months	low process temperature (approx. 70 °C) smooth coating growth in the intermetallic phase between Cu and Sn layer thickness > 1 μm required for multiple soldering rapid processing in the assembly process
Chemical silver cAg	Yes	0,25 ... 0,35 μm	12 months	low process temperature (approx. 50 °C) smooth coating very good solder-ability / hole filling compatible with all lead-free solders rapid processing in the assembly process