Automatic Wafer Cleaning Device After Light Resistance

Automatic Wafer Cleaning Device After Light Resistance

Product Description

Application field: removal of photoresistance/wafer cleaning after grinding

Wafer size: 150mm&200mm&300mm (customizable)

Process indicators: wafers with processes above 19nm can be cleaned

Automatic Wafer Plating Machine features:

Equipped with 2 or 3 Load ports

Industrial control machine touch screen operation control, convenient and fast

Use genuine industrial iot configuration software for control and monitoring

Support SECS/GEM communication protocol and data transmission

Horizontal chamber, no cross contamination

Equipped with two-arm wafer handling manipulator imported from Japan, efficient and stable

Equipped with up to 8 cleaning chambers (customized)

Cleaning liquid independent control, no cross contamination

Equipped with nozzle liquid flow accurate control system

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